GONG Jun, General Manager of Shanghai Smart Vehicle Cooperating Innovation CenterCo., Ltd.

LEl Guangyin, Professor of Academy for Engineering and Technology, Fudan University

NING Pugi, Professor of EV Department, Institute of Electrical Engineering, ChineseAcademy of Sciences (CAS)

WANG Yongkun, Associate Professor and Secretary of the Party Branch ofthe ElectronicPackaging Department, School of Mechano-Electronic Engineering, XiDian University

CHEN Cai, Associate Professor, School of Electrical and Electronic Engineering,Huazhong University of Science and Technology

Yole Intelligence, FAW Research and Development Institute, SMEC, National NewEnergy Vehicle, HMTC, Sungrow E-Power, OMNI POWERTRAIN, Shanghai Edrive,Infineon, AccoPower Semiconductor, Sumitomo Bakelite, CRRC, PSL, BoschmanUniSic,onsemi, Sanan Semiconductor, Silan Microelectronics, Fudan University.Hefei University ofTechnology, ShenZhen SiCred (by speech order)

Semiconductor Companies: Nexperia, DANFOSS, UAES , SHANXI SEMISIC, SuzhouNovosense, GEENER, topelectronics, alpha-powers, SICHAIN, UAES, Beijing ZKSemicondudor, ZINSlGHT Technology (Shanghai), HVT, Beijing Chipower, tsinghuaicASl, SwissSEM, Mitsuichemicals, Dupont, GRGTEST, CNCMIC, Jiansan, Qixing-electronics,Goermicro, NARl Lianyan Semiconductor, Digipower (HK), JHAS, TREX TECHNOLOGY,Changzhou Fuxi Semiconductor……

OEMs: FAW, SAIC, GAC, DONGFENG, Great Wall, changan, Beijing Electric Vehicle、Geely,BYD, Li Auto, Xpeng, NIO, HMTC, TOYOTA, ZEEKER, LEAPMOTOR, Lutous……

Powertrain: Shanghai E-propulsion, Shanghai Edriv,AtomDrive, Nio eDrive System,HYCET E-Chuang, Huawei,INOVANCE, BorgWarner, ZF, Schaeffler, BOSCH, DENSO,Valeo.MITSUBISHl,Vitesco, Magna