Hua semiconductor Co.,Ltd
Hua Semiconductor Co., Ltd. is headquartered in Shanghai's Zhangjiang High-Tech Park. The company specializes in the design, R&D, packaging, testing, and production of automotive-grade power semiconductor IGBT/SiC chips and modules, while serving emerging markets such as new energy vehicles, photovoltaics, and energy storage.
With a core team composed of professionals from renowned global semiconductor and automotive electronics companies, the company possesses key technologies in chip design, product development, and module manufacturing. It operates an R&D center in Shanghai and maintains an automotive-grade reliability laboratory in Lingang, Shanghai. Through its established automotive semiconductor innovation consortium with Shanghai Jita Semiconductor Co., Ltd., the company ensures dedicated production capacity and technical support. Its state-of-the-art automotive semiconductor production line and factory in Dongtai City, Jiangsu Province have obtained IATF 16949 automotive-grade quality system certification, fully meeting international certification standards. The company has secured design wins from multiple leading customers in new energy vehicle motor control systems and power supply applications.
Product 1
Development technology/material/manufacturing process name1200V SiC Chip-Embedded Module
Innovation HighlightsEnhanced High-Temperature Reliability:By adopting novel materials, we resolve the pain points of material incompatibility under extreme heat.
1.Enhanced High-Temperature Reliability:By adopting novel materials, we resolve the pain points of material incompatibility under extreme heat.
2.Superior Efficiency:Stray inductance reduction leads to a 20% decrease in power losses, significantly boosting energy conversion efficiency.
3.Excellent Thermal Management:Reduced thermal crosstalk between chips lowers Rth by 5–10%, while providing superior structural integrity and resistance to thermal warpage.
4.Cost-Effective Innovation:A unique PCB stack-up design balances high-voltage isolation with optimal cooling, utilizing copper sintering to drive down total system cost.
ApplicationsTraction Inverter
Photo of exhibits recommended
Product 1
Development technology/material/manufacturing process name1200V SiC Enhanced Power Module
Innovation Highlights Introducing the next-generation power block for New Energy Vehicle (NEV) traction inverters. Compatible with both Si and SiC technologies, this device utilizes an AMB ceramic substrate and copper clip technology to replace conventional wire bonding, significantly reducing parasitic parameters while enhancing thermal performance and current density.
Integrating four SiC chips, this solution doubles the energy density of traditional TPAK packages, achieving a thermal resistance as low as 0.0965 °C/W. Despite its compact size—only one-third the volume and 30% lighter than conventional modules—it delivers robust performance. Featuring a double-sided aluminum water cooling design, it ensures the chip junction temperature remains below 170°C even under demanding 850V / 650Arms conditions. Furthermore, the synergy between copper clip technology and silver sintering optimizes thermal expansion matching (16.5 ppm/K), effectively minimizing stray inductance and thermal stress.
Applications Traction Inverter
Photo of exhibits recommended
Product 1
Development technology/material/manufacturing process nameT2PAK Power Device
Innovation Highlights To achieve higher power density while reducing process complexity and production costs, T2PAK devices utilize traditional tin soldering for power terminals , eliminating the need for costly laser welding equipment. This solution enhances current carrying capacity by 50% and integrates efficient heat dissipation capabilities, reducing thermal resistance by approximately 15% compared to conventional modules. These features effectively ensure safe operation under high power density conditions and have successfully passed the stringent AEC-Q101 and AQG324 reliability certifications.
Applications Traction Inverter
Photo of exhibits recommended