Jiangsu Ferrotec Semiconductor Technology Co.,Ltd
FLH provides its customers with coptive-covered ceramic carrier plates for power semiconductor modules, relying on the advanced production technology acquired by Ferrotec Group in the field of coptive-covered ceramic carrier plates for 30 years since 1995. Adhering to the business philosophy of "diligence, determination, development, and excellence", we provide strong support for the rapid development of semiconductor power module business by providing service and support to our customers with higher and more refined quality.Ferrotec(FLH) headquarters (Jiangsu Ferrotec Semiconductor technology Co., LTD.) is located in High-tech zone, Dongtai, Jiangsu province of China, which is specialized in the business of copper bonded ceramic substrate (AMB, DCB and DPC) for power semiconductor, integrating R&D, manufacturing, sales, providing power semiconductor manufacturers a complete set of solution from materials, manufacture, assembly and test.
Its subsidiaries include Shanghai Ferrotec Power Semiconductor Co., LTD., Jiangsu Ferrotec Power Semiconductor R&D Institute Co., LTD., Shanghai Ferrotec International Trading Co., LTD., Sichuan Ferrotec Power Semiconductor Technology Co., Ltd., Ferrotec Power Semiconductor Malaysia SDN.BHD., Ferrotec Power Semiconductor (Singapore) PTE. LTD., and subsidiaries in Europe, Japan.
Product 1
Development technology/material/manufacturing process nameDAB(Direct Aluminum Bonded) substrate
Innovation HighlightsFLH DAB (Direct Aluminum Bonded) substrates are independently developed in-house covering powder materials to sintering processes, breaking the monopoly held by Japanese manufacturers.
Featuring outstanding electrical insulation, superior heat dissipation and high durability, DAB substrates fully meet strict automotive-grade standards for high-voltage electric drive control systems and power modules. While maintaining leading performance, FLH DAB ceramic aluminum substrates cut costs by approximately 30% to 40% compared with imported alternatives, granting them strong competitive edges in China’s new energy vehicle market.
Applications Hybrid cars, industrial inverters, wind power electric vehicles, and orbital trains.
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Product 1
Development technology/material/manufacturing process nameAMB copper bonded ceramic substrates
Innovation HighlightsFLH AMB substrates adopt active metal brazing technology, featuring high thermal conductivity, high mechanical strength and excellent thermal shock resistance.They deliver far superior temperature cycling reliability compared with mainstream products on the market, with ultra-low void ratio and high bonding strength.
These advantages effectively enhance the reliability of thick-copper products (T≥0.8mm) with higher power and heat dissipation demands, widely applied in automotive main drive inverters, OBC, vehicle-mounted DC/DC converters, high-power DC/DC chargers and high-voltage electrical components, ensuring stable product quality.
ApplicationsMain drive inverters, SiC power modules, etc.
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Product 1
Development technology/material/manufacturing process nameDCB copper bonded ceramic substrates
Innovation HighlightsFLH DCB copper-clad ceramic substrates are fabricated by high-temperature direct sintering process to bond copper foil to ceramic substrates. They feature good thermal cycle performance, high mechanical strength, high thermal conductivity, reliable insulation and high current-carrying capacity. Various circuit structures can be etched on the copper surface. With an operating temperature range from -55℃ to 850℃ and a thermal expansion coefficient similar to silicon, they are suitable for new energy vehicle electronic control, on-board power supplies and other application scenarios.
ApplicationsOn-Board Charger (OBC), DC-DC converters and other medium-power components for new energy vehicles
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