Anhui RedPower Microelectronics Co.,Ltd.
Anhui Redpower Microelectronics Co., Ltd. was established on June 28, 2019. As of now, the company's registered capital is 209.54 million yuan. It is located in Yijiang District, Wuhu City, Anhui Province. It is a strategic emerging enterprise specializing in the design of IGBT/FRD and silicon carbide MOS/SBD chips, power module packaging and testing, and system application solutions. The company focuses on the new energy market such as electric vehicles, wind power, photovoltaic, energy storage, and charging piles, while also taking into account the demands of power quality and industrial control. It is committed to growing into an outstanding domestic power semiconductor manufacturer.
Product 1
Development technology/material/manufacturing process nameAutomotive A5 Series IGBT Power Module
Innovation Highlights The A5 module features low loss and high powerdensity, designed for 160 C junction temperatureoperation, compatible with 400V/800V voltageplatforms, and suitable for 50-180kW electric vehicleapplications. More compact than industry-standardpackage, (e.g., HPD)it adopts copper terminal laserwelding technology and coreless current sensorcompatibility. Equipped with Ruide 8th-generationchips, it sustains peak output of 540Arms. Combinedwith oval PinFin direct liquid cooling, it achieves higherpower density. Its compact design and high compatibili-ty meet demands for miniaturized electric equipmentand integrated scenarios, propelling electric drivesystems toward miniaturization and cost-effectiveness
Applications Electric drive
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Product 1
Development technology/material/manufacturing process nameAutomotive A6 Series IGBT Power Module
Innovation HighlightsThe A6 module features low loss, low stray inductance and high heat dissipation. It is compatible with 400V/800V voltage platforms and HPD packages, meeting the requirements of electric vehicle applications with a power range of 50~220kW.
Adopting an elliptical Pinfin direct liquid cooling structure and equipped with the 8th-generation Ruidi chips, it uses multi-chip parallel connection and laminated busbar design to reduce voltage spikes and EMI interference, improving system reliability.
With a maximum continuous output of 650Arms, it satisfies the high power density demands of automotive applications.
Applications Electric drive
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Product 1
Development technology/material/manufacturing process name Automotive A4 Series IGBT Power Module
Innovation Highlights The A4 module features low loss, high reliability, andhigh power density, making it suitable for 400V voltage
platforms with a maximum output power of up to140kW.Compatible with HP1 DC6(i) package series,this moduleemploys press-fit packaging technology to eliminatewelding stress and extend service life. Its PinFin directliquid cooling structure reduces thermal resistance,lowering cooling costs. With its compact size, themodule offers a more cost-effective solution comparedto similar packaging technologies. The introduction ofthe A4 module will accelerate the evolution of electricvehicles toward higher power, enhanced reliability, andreduced costs.
Applications Electric drive
Photo of exhibits recommended