Beijing QLSEMl Technology Co., Ltd

QLSEMI is headquartered in the Beijing Economic andTechnological Development Zone,with a equipment research&production base and a customer service center in Suzhou.The Company is committed to providing high-reliability packaging solutions for high-performance power devices.Our main business covers four main areas:R&D,production and sales of packaging materials and packaging & testing equipment,as well as packaging process development and device reliability evaluation.The company operates Class 10000 and Class 1000 cleanrooms,ensuring stable mass production of products,which have been certified by IS09001,IS014001,IS045001, IATF16949, and QC080000.

Product 1
Development technology/material/manufacturing process name

Copper Foil with Sintering Film

Innovation Highlights

QLDTF7021 is a copper foil with sintering film suitable on die top sintering. It offers excellent electrical conductivity, thermal performance, and high-reliability. It can achieve highly reliable sintering connections on gold, silver, silver/copper sintering on the top of high-power devices.

Development phase

量产

Applications

hybrid drive,electric drive, etc..

Photo of exhibits recommended

Product 1
Development technology/material/manufacturing process name

Silver Sintering Paste

Innovation Highlights

QLAg1110 are nano-silver pastes designed for pressure sintering processes. It utilizes a self-developed paste formulation with excellent electrical and thermal conductivity and high shear strength. These pastes enable highly reliable sintered connections on gold, silver, and copper substrates, providing a high-reliability packaging solution for high-power devices.

Development phase

量产

Applications

Traditional powertrains, hybrid Px, DHT,electric drive, etc.

Photo of exhibits recommended

Product 1
Development technology/material/manufacturing process name

Copper Large-Area Sintering Paste

Innovation Highlights

Qlsemi has developed silver/copper large-area sintering pastes and silver large-area sintering preforms specifically for interconnections between heatsinks and modules. These products enable sintering at conditions as low as 220°C and 7 MPa, offering customers highly reliable large-area sintering solutions for SIC/IGBT packaging applications.

Development phase

量产

Applications

Traditional powertrains, hybrid Px,DHT,electric drive,etc.

Photo of exhibits recommended

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