Shenzhen Advanced Joining Technology Co., Ltd.
Shenzhen Advanced Joining Co, Ltd. (AJM)
Founded in 2015, AJM is a National High-tech Enterprise and a National Specialized, Refined, Unique and Innovative "Little Giant" Enterprise. We focus on advanced packaging of power semiconductors, mainly providing supporting materials, equipment and technical services.
Leveraging core silver/copper sintering technology and glass substrate packaging solutions, we have built integrated capabilities covering materials, equipment and processes, covering the whole process of R&D, manufacturing, process optimization and mass production. Dedicated to the industrialization of cutting-edge technologies, we deliver high-quality and reliable solutions for clients in the new energy and automotive electronics sectors.
Product 1
Development technology/material/manufacturing process nameAS-50K: Fully Automatic High-Precision Sintering Production Machine
Innovation Highlights Equipped with independent pressure heads, the AS-50K sintering machine delivers precise pressure control and adapts to product height differences within 2mm. It integrates preheating, sintering and cooling stations with full-process automation, supporting automatic film lamination and multi-formula storage. With a maximum UPH of 360, it boosts efficiency and cuts costs, ideal for high-volume silver sintering production.
Applications New Energy Vehicles.Electric Power.Industrial Electronics.Rail Transit.Photovoltaic Power.Aerospace
Photo of exhibits recommended
Product 1
Development technology/material/manufacturing process nameAS-09K: Rotary Pilot Mass Production Sintering Machine
Innovation Highlights AS-09K rotary pilot production sintering machine integrates fully automatic three stations: preheating, sintering and cooling. It achieves precise temperature control up to 300℃ with fast heating and cooling rates, delivers a maximum pressure of 10 tons, and accommodates product height differences up to 10 mm. Protected by vacuum and nitrogen atmosphere throughout the process, its dynamic pressure head enables accurate pressure tracking, with an effective sintering area of 250*175 mm. Durable and low in operation cost, it supports real-time access to temperature and pressure monitoring curves, suitable for both pilot verification and mass production.
ApplicationsNew Energy Vehicles.Electric Power.Industrial Electronics.Rail Transit.Photovoltaic Power.Aerospace。
Photo of exhibits recommended
Product 1
Development technology/material/manufacturing process nameDevoted to sintering technology, we customize embedded PCB sintering solutions
Innovation HighlightsThis technology focuses on diversified embedded sintering, covering embedded PCB design, sintering and full-process inspection with custom non-standard solutions available. Supported by in-depth cooperation with leading PCB and chip manufacturers, it also provides wafer copper plating, high-precision Cell fabrication, along with supporting sintering equipment, materials and sample trial services. With mature process standards ensuring consistent production and a comprehensive Cell packaging & testing system, it caters to products of various power ratings, delivering an efficient and hassle-free one-stop solution.
Applications New Energy Vehicles.Electric Power.Industrial Electronics.Rail Transit.Photovoltaic Power.Aerospace。
Photo of exhibits recommended